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ARCHIVE INFORMATION
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RF Device Data
Freescale Semiconductor
MRF6P3300HR3 MRF6P3300HR5
Table 3. ESD Protection Characteristics
Test Methodology
Class
Human Body Model (per JESD22-A114)
3B (Minimum)
Machine Model (per EIA/JESD22-A115)
C (Minimum)
Charge Device Model (per JESD22-C101)
IV (Minimum)
Table 4. Electrical Characteristics (TC
= 25
°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
Off Characteristics (1)
Zero Gate Voltage Drain Leakage Current
(4)
(VDS
= 68 Vdc, V
GS
= 0 Vdc)
IDSS
10
μAdc
Zero Gate Voltage Drain Leakage Current
(4)
(VDS
= 32 Vdc, V
GS
= 0 Vdc)
IDSS
1
μAdc
Gate-Source Leakage Current
(VGS
= 5 Vdc, V
DS
= 0 Vdc)
IGSS
1
μAdc
On Characteristics (1)
Gate Threshold Voltage
(VDS
= 10 Vdc, I
D
= 350
μAdc)
VGS(th)
1
2.2
3
Vdc
Gate Quiescent Voltage
(VDD
= 32 Vdc, I
D
= 1600 mAdc, Measured in Functional Test)
VGS(Q)
2
2.8
4
Vdc
Drain-Source On-Voltage
(VGS
= 10 Vdc, I
D
= 2.4 Adc)
VDS(on)
0.22
0.3
Vdc
Dynamic Characteristics (1,2)
Reverse Transfer Capacitance
(VDS
= 32 Vdc
±
30 mV(rms)ac @ 1 MHz, V
GS
= 0 Vdc)
Crss
1.4
pF
Functional Tests (3)
(In Freescale Narrowband Test Fixture, 50 ohm system) V
DD
= 32 Vdc, I
DQ
= 1600 mA, P
out
= 270 W PEP,
f1 = 857 MHz, f2 = 863 MHz
Power Gain
Gps
19
20.2
23
dB
Drain Efficiency
ηD
41
44.1
%
Intermodulation Distortion
IMD
-30.8
-28
dBc
Input Return Loss
IRL
-24
-9
dB
Pout
@ 1 dB Compression Point, CW
(f = 860 MHz)
P1dB
320
W
Each side of the device measured separately.
Part internally matched both on input and output.
Measurement made with device in push-pull configuration.
Drains are tied together internally as this is a total device value.
相关PDF资料
MRF6P9220HR5 MOSFET RF N-CH 28V 47W NI-860C3
MRF6S18060NBR1 MOSFET RF N-CH 26V 60W TO272-4
MRF6S18100NR1 MOSFET RF N-CH 28V 100W TO2704
MRF6S18140HSR5 MOSFET RF N-CH 28V ESD NI880S
MRF6S19060GNR1 MOSFET RF N-CH 28V TO-270-2 GW
MRF6S19100GNR1 MOSFET RF N-CH 28V TO-270-2 GW
MRF6S19100HSR5 MOSFET RF N-CHAN 28V 22W NI-780S
MRF6S19120HSR5 MOSFET RF N-CHAN 28V 19W NI-780S
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